Decapsulation - Internal Die Verification
Decapsulation is a process used to expose the internal structure of an integrated circuit. The de-cap process is completed using a mixture of fuming Nitric acid and fuming Sulfuric acid heated to a certain temperature. This mixture etch away polymer encapsulants or exterior of a device to exposing bonding wires, internal structure, and the die. When the manufacture logo and markings are found. Markings are then compared to G.E.T.S. internal database of known good parts.